02136nam a22002897a 4500003000400000005001700004008004100021022001400062040000900076100002100085130003900106245015300145264006900298300001400367336000900381337001600390338001200406440002800418500126800446650002201714650002801736650001801764650001301782650001501795700001501810700002101825OSt20261007102243.0261007b        |||||||| |||| 00| 0 eng d  a1738-1266  cDSSC  aGong, Yuan Juan   aJournal of Biosystems Engineering   aDrying ginseng slices using a combination of microwave and far-infrared drying techniques /cYuan Juan Gong, Ying Sui, Chung Su Han, Xiao Feng Ning   aKorean :bThe Korean Society for Agricultural Machinery, c2016.  app. 34-42  atext  aunmediated   avolume   v41(1), 34-42x1738-1266  aThis study was performed to improve the drying quality and drying rate of ginseng slices by combining microwave and far-infrared drying techniques. Methods: Based on single-factor experiments and analyses, a quadratic regression orthogonal rotation combination design was adopted to study the effects of the moisture content at the conversion point between the microwave and far-infrared techniques, the ginseng slice thickness and the far-infrared drying temperature on the chip drying time, the surface color difference value, the nutritional composition and the surface shrinkage rate index. Results: Compared to the far-infrared drying alone, the combined microwave and far-infrared drying resulted in an increase in the saponin content of the ginseng slices and reductions in the drying time, surface color difference, and shrinkage rate. Conclusions: We established a mathematical model of the relationships between the surface shrinkage rate index and the experimental factors using the multi-objective nonlinear optimization method to determine the optimal parameter combination, which was confirmed to be the following: microwave and far-infrared moisture contents of 65%, a ginseng slice thickness of 1 mm, and a far-infrared drying temperature of 54 C. 0aCombined process  0adrying characteristics  0aFar-infrared  0aGinseng  0aMicrowave   aSui, Ying   aNing, Xiao Feng